JPH0353511Y2 - - Google Patents
Info
- Publication number
- JPH0353511Y2 JPH0353511Y2 JP8626986U JP8626986U JPH0353511Y2 JP H0353511 Y2 JPH0353511 Y2 JP H0353511Y2 JP 8626986 U JP8626986 U JP 8626986U JP 8626986 U JP8626986 U JP 8626986U JP H0353511 Y2 JPH0353511 Y2 JP H0353511Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- case
- electrodes
- threaded
- high voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
Landscapes
- Rectifiers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8626986U JPH0353511Y2 (en]) | 1986-06-06 | 1986-06-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8626986U JPH0353511Y2 (en]) | 1986-06-06 | 1986-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62197867U JPS62197867U (en]) | 1987-12-16 |
JPH0353511Y2 true JPH0353511Y2 (en]) | 1991-11-22 |
Family
ID=30942418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8626986U Expired JPH0353511Y2 (en]) | 1986-06-06 | 1986-06-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0353511Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6108026B1 (ja) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | 圧接型半導体モジュール |
-
1986
- 1986-06-06 JP JP8626986U patent/JPH0353511Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62197867U (en]) | 1987-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5891759A (en) | Method of making a multiple heat sink resin sealing type semiconductor device | |
JPH0353511Y2 (en]) | ||
JPWO2002095824A1 (ja) | 電源回路装置 | |
JP2921416B2 (ja) | 固体電解コンデンサ及びその製造方法 | |
CN214281341U (zh) | 一种陶瓷电容滤波器 | |
JPH0621255Y2 (ja) | 高電圧半導体装置 | |
EP0809861B1 (en) | Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device | |
CN112713866B (zh) | 一种陶瓷电容滤波器及其生产方法 | |
US3573566A (en) | Solid electrolyte capacitor with axial leads and method of attaching the same | |
CN218447907U (zh) | 一种多级串联的层叠式封装硅堆 | |
JPH10172865A (ja) | チップ形固体電解コンデンサ | |
US3570119A (en) | Method of making an encapsulated component | |
JPH046199Y2 (en]) | ||
JPH0517888Y2 (en]) | ||
CN218447906U (zh) | 一种层叠式封装硅堆的单体结构 | |
JPH046213Y2 (en]) | ||
JPH0436103Y2 (en]) | ||
JP2542302Y2 (ja) | チップ型バリスタ | |
JPH0513015Y2 (en]) | ||
JPH037870Y2 (en]) | ||
JPH0233942A (ja) | 半導体装置用碗状樹脂モールドケースの成形方法 | |
JPS5833719Y2 (ja) | 半導体装置 | |
JPH027458Y2 (en]) | ||
JPS6227548B2 (en]) | ||
JPH06232011A (ja) | チップ型固体電解コンデンサ |